COMINDEX is taking part in the 17th International Congress of Adhesion and Adhesives

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COMINDEX is taking part in the 17th International Congress of Adhesion and Adhesives

Tuesday, 12 July, 2016

The 17th International Congress of Adhesion and Adhesives will be held in Madrid on 15th and 16th September 2016, and Comindex will be actively taking part, giving a presentation on Rheological Additives for Silane-Terminated Polymers. The presentation will be given by Comindex technical sales advisor David Cuerva who will be conveying the details we have been working on alongside BYK Chemie (Tobias Austermann, Head of End-Use Adhesives & Sealants).

The aim of the congress is to provide a scientific and technical forum for sharing knowledge and technology, also addressing related phenomena and applications in the field of adhesion and adhesives. This edition has achieved international status and it has been organised by the School of Industrial Design and Engineering of the Technical University of Madrid. The main subject will be the application of adhesives to industrial design and the simulation of adhesive bonding.

URL: 

www.congreso-adhesivos.es

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